• 2: Products
  • 2.1: Overview
  • 2.2: Technology
  • 2.3: Xtensa Customizable
    • 2.3.1: Configurable
    • 2.3.2: Config & Extensible
    • 2.3.3: About Xtensa
    • 2.3.4: Xtensa 7
    • 2.3.5: Xtensa LX2
  • 2.4: Audio DSP
    • 2.4.1: Technology
    • 2.4.2: 330 HiFi
    • 2.4.3: HiFi 2 Audio Engine
    • 2.4.4: Audio Codecs
    • 2.4.5: Voice Codecs
    • 2.4.6: Low Power MP3 Playback
    • 2.4.7: Blu-ray Disc
    • 2.4.8: Digital Radio
    • 2.4.9: Free Music
  • 2.5: Video DSP
    • 2.5.1: 388VDO
    • 2.5.2: 388VDO Architecture
  • 2.6: Comms DSP
    • 2.6.1: ConnX Vectra DSP Engine
    • 2.6.2: ConnX 545CK
    • 2.6.3: ConnX Baseband Engine
    • 2.6.4: Custom DSP Configurations
  • 2.7: Diamond Controllers
    • 2.7.1: Architecture
    • 2.7.2: 106Micro Small
    • 2.7.3: 106Micro for FPGAs
    • 2.7.4: 108Mini Low Power
    • 2.7.5: 212GP General Purpose
    • 2.7.6: 232L for Linux
    • 2.7.7: 570T High Perf
    • 2.7.8: Comparisons
    • 2.7.9: Competition
    • 2.7.10: Direct Intefaces
    • 2.7.11: Emulation Boards
    • 2.7.12: AMBA Bridges
    • 2.7.13: Software
    • 2.7.14: Free SW Eval
  • 2.8: HW/SW Dev Tools
    • 2.8.1: For Processor Designers
    • 2.8.2: For Software Developers
    • 2.8.3: IDE and RTOS Support
    • 2.8.4: HW Emulation
  • 2.9: Literature, Docs & Videos
    • 2.9.1: White Papers
    • 2.9.2: Videos
    • 2.9.3: Application Notes
    • 2.9.4: Success Stories
    • 2.9.8: Documentation
• 3: Markets
  • 3.1: Overview
  • 3.2: Control Processor
  • 3.3: Mobile Handset
  • 3.4: Home Entertainment
    • 3.4.1: DVD & Blu-ray Disc
    • 3.4.2: Digital TV
    • 3.4.3: Set-top Boxes
    • 3.4.4: Digital Radio
  • 3.5: Mobile Entertainment
  • 3.6: Network Access
  • 3.7: PCs/Ntbks & Printers
  • 3.8: Networking/Storage
  • 3.9: Customer Gallery
    • 3.9.1: Handsets
    • 3.9.2: Printers/Scanners
    • 3.9.3: Graphics
    • 3.9.4: Entertainment
    • 3.9.5: Network Access
    • 3.9.6: Network Infrastructure
    • 3.9.7: Storage Networking
    • 3.9.8: Wireless
    • 3.9.9: Others
• 4: Methodology
  • 4.1: Overview
  • 4.2: Dataplane Design
  • 4.3: Multicore Design
    • 4.3.1: Design Process
    • 4.3.2: Modeling
    • 4.3.3: Partitioning
    • 4.3.4: Task Assignments
    • 4.3.5: Interconnect
    • 4.3.6: Communications
    • 4.3.7: Interfaces
  • 4.4: ESL Design
  • 4.5: C/C++ Design
  • 4.6: Speed RTL Design
    • 4.6.1: Performance
    • 4.6.2: I/O Throughput
    • 4.6.3: No State Machines
    • 4.6.4: GSM Example
    • 4.6.5: Viterbi Example
    • 4.6.6: MPEG-4 Example
    • 4.6.7: Low Power
    • 4.6.8: Design Faster
  • 4.7: Low Power Design
  • 4.8: Optimized with TIE
  • 4.9: EDA Flow
    • 4.9.1: Matlab
  • 4.10: System Modeling
• 5: Partners
  • 5.1: Overview
  • 5.2: Operating Systems
    • 5.2.1: Embedded Alley
    • 5.2.2: Express Logic
    • 5.2.3: Linux
    • 5.2.4: Mentor Graphics
    • 5.2.5: Sophia Systems
    • 5.2.6: Timesys
  • 5.3: HW Proto & Emulation
    • 5.3.1: Avnet
    • 5.3.2: Eve
    • 5.3.3: HyperSilicon
    • 5.3.4: Synplicity
    • 5.3.5: S2C
  • 5.4: JTAG Probes
    • 5.4.1: ByteTools
    • 5.4.2: FS2
    • 5.4.3: Lauterbach
    • 5.4.4: Macraigor Systems
    • 5.4.5: Sophia Systems
    • 5.4.6: Yokogawa
  • 5.5: SOC Design Centers
    • 5.5.1: ADTechnology
    • 5.5.2: Aftek
    • 5.5.3: D-Clue Technologies
    • 5.5.4: HCL
    • 5.5.5: hd Lab, Inc.
    • 5.5.6: IBEX Technology Co.
    • 5.5.7: MegaChips
    • 5.5.8: Magellan Discovery Corp
    • 5.5.9: Sibridge Technologies
    • 5.5.10: SiliconXpress
    • 5.5.11: SoC Solutions
    • 5.5.12: Tallika
    • 5.5.13: Tata Elxsi
    • 5.5.14: Wipro
  • 5.6: Audio Software Packages
  • 5.7: Application Software
    • 5.7.1: AM3D
    • 5.7.2: Coding Technologies
    • 5.7.3: Commetrex
    • 5.7.4: Dolby Laboratories
    • 5.7.5: DTS
    • 5.7.6: Express Logic
    • 5.7.7: iBiquity
    • 5.7.8: Ittiam Systems
    • 5.7.9: Mentor Graphics
    • 5.7.10: Microsoft
    • 5.7.11: Morpho
    • 5.7.12: P-Product
    • 5.7.13: QSound Labs
    • 5.7.14: RealNetworks
    • 5.7.15: SONiVOX
    • 5.7.16: SPIRIT DSP
    • 5.7.17: SRS Labs
    • 5.7.18: Stonestreet One
    • 5.7.19: Thomson Multimedia
  • 5.8: SW Design Centers
    • 5.8.1: P-Product
    • 5.8.2: Rhonda
    • 5.8.3: UpZide
  • 5.9: Silicon Sources
    • 5.9.1: Altera
    • 5.9.2: eASIC
    • 5.9.3: Fujitsu America
    • 5.9.4: IBM
    • 5.9.5: NEC
    • 5.9.6: TSMC
    • 5.9.7: UMC
    • 5.9.8: Xilinx
  • 5.10: EDA Tools
    • 5.10.1: Atrenta
    • 5.10.2: Cadence
    • 5.10.3: Magma
    • 5.10.4: Mentor Graphics
    • 5.10.5: Synopsys
  • 5.11: ESL/Virtual Platforms
    • 5.11.1: Carbon Design Systems
    • 5.11.2: CircuitSutra
    • 5.11.3: CoWare
    • 5.11.4: Imperas
    • 5.11.5: VaST
  • 5.12: Libraries/Memories
    • 5.12.1: ARM
    • 5.12.2: Novelics
    • 5.12.3: Synopsys
    • 5.12.4: Virage Logic
  • 5.13: University Program
    • 5.13.103: University Program Licensing Policy
    • 5.13.104: Contact Info & FAQs
    • 5.13.105: Application Form
    • 5.13.106: License Agreement
    • 5.13.107: Renewal Agreement
    • 5.13.108: Program Info Form
    • 5.13.109: Publications from Universities
• 6: News & Events
  • 6.1: Overview
  • 6.2: Press Releases
    • 6.2.2: Press Releases 2009
    • 6.2.3: Press Releases 2008
    • 6.2.4: Press Releases 2007
    • 6.2.5: Press Releases 2006
    • 6.2.6: Press Releases 2005
    • 6.2.7: Press Releases 2004
    • 6.2.8: Press Releases 2003
    • 6.2.9: Press Releases 2002
    • 6.2.10: Press Releases 2001
    • 6.2.11: Press Releases 2000
    • 6.2.12: Press Releases 1999
  • 6.3: Articles
    • 6.3.1: Articles - 2009
    • 6.3.2: Articles - 2008
    • 6.3.3: Articles - 2007
    • 6.3.4: Articles - 2006
    • 6.3.5: Articles - 2005
    • 6.3.6: Articles - 2004
    • 6.3.7: Articles - 2003
    • 6.3.8: Articles - 2002
  • 6.4: Events
  • 6.5: Presentations
  • 6.6: Books
    • 6.6.1: Engineering the Complex SOC
    • 6.6.2: Designing with Configured Cores
    • 6.6.3: Designing Embedded Processors
    • 6.6.4: Processor Design
  • 6.7: Press Contacts
• 7: Company
  • 7.1: Overview
  • 7.2: Management Team
  • 7.3: Investors/Board
  • 7.4: Corporate Profile
  • 7.5: Customer Profiles
  • 7.6: History
  • 7.7: Careers
  • 7.8: Patents
  • 7.9: Quality
  • 7.10: Mailing List
  • 7.11: Directions
  • 7.11: Contact

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